Material FR-5 |
|
The material FR-5 is applied in production of multilayer printed-circuit boards. It has several essential advantages: high temperature of vitrification provides the high level of stability of the linear sizes and the lowered water absorption. |
Indicators |
Conditioning conditions |
Values |
Temperature
|
|
|
Vitrification temperature, Тg, o C |
|
155 |
Coefficient of temperature expansion (from 40 o to 120 o C), mm/ o C |
T |
|
on an axis Х |
|
7,7 x 10 -6 |
on an axis Y |
|
8,0 x 10 -6 |
on an axis Z |
|
8,9 x 10 -5 |
Electrical
|
|
|
Dielectric permeability with a frequency 1 MHz |
С - 40/23/50 |
4,75 |
Tangent of angle of dielectric losses with a frequency 1 MHz |
С - 40/23/50 |
0,02 |
Dielectric breakdown, kV |
|
45 |
Specific volume electric resistance, Ohm x cm, not less |
E - 24/125 |
1,0 x 10 11 |
Physical
|
|
|
Durability on flaking of a foil, N/mm, not less |
normal conditions |
1,8 |
|
after a heatstroke (260 o С/30 sec) |
1,8 |
|
E - 1/125 |
1,44 |
Time of resistance to influence of the melted solder, sec, not less |
288 o С |
120 |
Water absorption, not more |
D - 24/23 |
0,1 |
Combustibility |
normal conditions |
V0 |