Manufacturing possibilities

Pacific microelectronics Inc. (Taiwan) – is a modern PCB manufacturing
according to IPC 6012 and GOST
23751-86, 3751-86 with the following process possibilities:

Wide range of PCB cover

Layers quantity	1-layer PCB
	2-layer PCB
	multilayer PCB from 4 to 28 layers
Used material	FR-2, FR-4, CEM-1, FR-4 High TG, PI, PTFE, PPO, Rogers, Taconic and others.
The width of the conductor	from 0,1 mm
The distance between adjacent conductors	from 0,1 mm
The distance between adjacent elements of the printed circuit	from 0,2 mm
The diameter of the vias	from 0,1 mm
Standard thickness of the copper foil	18 mkm
	35 mkm
Cover	Hot tin coating HAL thickness of 15 ~ 20 mkm
	Immersion Ni-Au plating thickness of 5 mkm (Ni) + 0.1 mkm (Au)
	Electroplated Ni-Au plating thickness of 5 mkm (Ni) + 1 mkm (Au)
	Immersion tin
	Carboxylic paste application
	Gold-plated lamels
Solder mask	liquid photo-manifested in different colors (green, blue, red, yellow, black, etc.).
Gap mask area	0,1 mm
The thickness line of the silk screen	from 0,1 mm
Processing PCB contour	milling
	V-cut
	stamp
Precision processing circuit	- 0,1 mm
Possible thickness of FR4 material	0,3 mm
	0,5 mm
	0,8 mm
	1,0 mm - standard
	1,5 mm - standard
	1,6 mm - standard
	2,0 mm
The maximum workpiece size	1-2-layers PCB 550 mm x 550 mm
	milti-layer PCB 460 mm x 508 mm
Quality control	Adapter e-test
	Flying probe e-test
	A.O.I.
Accepted file format	PCAD 4.5, PCAD 8; ACCEL EDA, PCAD 200X, PROTEL, ORCAD, EAGLE, DEP7, CAM350, CAMTASTIC, Gerber files.
Additional manufacturing features	Production of multi-layer PCB with blind and hidden vias
	Manufacture of PCB on metal base
	PCB on high-frequency, high-temperature materials
	Production flexible PCB

For calculation of the order for PCB please fill out the online form or after downloading the order form send it to us by e-mail. You will receive a quotation for PCB manufacturing within one day.